The ZSSC3026 is a sensor signal conditioner (SSC) integrated circuit for high-accuracy amplification and analog-to-digital conversion of a differential input signal. Designed for high-resolution altimeter module applications, the ZSSC3026 can perform offset, span, and 1st and 2nd order temperature compensation of the measured signal. Developed for correction of resistive bridge sensors, it can also provide a corrected temperature output measured with an internal sensor. The measured and corrected bridge values are provided at the digital output pins, which can be configured as I2C (≤ 3.4MHz) or SPI (≤ 20MHz). Digital compensation of signal offset, sensitivity, temperature, and non-linearity is accomplished via an 18-bit internal digital signal processor (DSP) running a correction algorithm. Calibration coefficients are stored on-chip in a highly reliable, non-volatile, multiple-time programmable (MTP) memory. Programming the ZSSC3026 is simple via the serial interface. The IC-internal charge pump provides the MTP programming voltage. The interface is used for the PC-controlled calibration procedure, which programs the set of calibration coefficients in memory. Digital mating of the sensor with the signal conditioner is fast and precise, eliminating the overhead normally associated with trimming external components and multi-pass calibration routines.

Features

  • Flexible, programmable analog front-end design, up to 16-bit scalable, charge-balancing two-segment analog-to-digital converter (ADC)
  • Fully programmable gain amplifier accepting sensors from 14 to 72 (linear factor)
  • Internal auto-compensated temperature sensor
  • Digital compensation of individual sensor offset
  • 1st and 2nd order digital compensation of sensor gain
  • Digital compensation of 1st and 2nd order temperature gain and offset drift
  • Intelligent power management unit
  • Layout customized for die-die bonding with sensor for high-density chip-on-board assembly
  • Typical sensor elements can achieve accuracy of less than ±0.10% FSO @ -40 to 110 °C

Product Options

下单器件 ID Part Status Pkg. Code Pkg. Type Lead Count (#) Temp. Range Carrier Type Buy Sample
ZSSC3026CC1B Active DICE WAFER 0 -40 to 85°C Wafer
Availability
ZSSC3026CI1B Active DICE WAFER 0 -40 to 85°C Wafer
Availability
ZSSC3026CI1D ES Active DICEW WAFER 0 -40 to 85°C WFP
Availability

技术资料

文档标题 他の言語 文档类型 文档格式 文件大小
数据手册与勘误表
ZSSC3026 Datasheet Datasheet PDF 704 KB
ZSSC3026 Short-form Datasheet Short Form Datasheet PDF 95 KB
使用指南与说明
Choosing the Right Sensor Signal Conditioning IC Guide PDF 300 KB
IDT CAD Altium Libraries for AID Products Rev 20160819 Guide ZIP 1.20 MB
ZSSC30x6 Evaluation Kit Description Manual PDF 2.10 MB
应用指南 &白皮书
IDT Wafer Dicing Guidelines Application Note PDF 44 KB
其它
Sensing Technologies and Sensor Solutions Overview ( 简体中文) English Overview PDF 2.57 MB
Sensor Signal Conditioning ICs for Industrial and Consumer Applications 日本語 Overview PDF 6.88 MB

软件与工具

文档标题 他の言語 文档类型 文档格式 文件大小
ZSSC3026 and ZSSC3036 Evaluation Kit Software Rev. 3.1_3026_3036 Software ZIP 8.10 MB

Evaluation Boards

Part Number Title 升序排列
ZSSC3026KIT Evaluation Kit for ZSSC3026