The QS3383 provides ten high-speed CMOS TTL-compatible bus switches. The low ON resistance of the QS3383 allows inputs to be connected to outputs without adding propagation delay and without generating additional ground bounce noise. Bus exchange configuration allows byte swapping of buses in systems. It can also be used as a 5-wide 2-to-1 multiplexer and to create low delay barrel shifters, etc. The QS3383 operates at -40C to +85C.

Features

  • Enhanced N channel FET with no inherent diode to Vcc
  • 5 ohm bidirectional switches connect inputs to outputs
  • Zero propagation delay, zero added ground bounce
  • Undershoot clamp diodes on all switch and control inputs
  • Bus exchange allows nibble swap
  • Available in 24 pin QSOP package

Product Options

下单器件 ID Part Status Pkg. Code Pkg. Type Lead Count (#) Temp. Grade Pb (Lead) Free Carrier Type Buy Sample
QS3383QG Active PCG24 QSOP 24 C Yes Tube
Availability
QS3383QG8 Active PCG24 QSOP 24 C Yes Reel
Availability

技术资料

文档标题 他の言語 文档类型 文档格式 文件大小
数据手册与勘误表
QS3383 Datasheet Datasheet PDF 211 KB
使用指南与说明
FCT Bus Switch Cross Reference Guide Guide PDF 568 KB
应用指南 &白皮书
AN-11: 5V and 3V Conversion with Zero Delay Application Note PDF 346 KB
Quickswitch Basics Application Note PDF 83 KB
TN-07: Analysis of QuickSwitch Behavior Application Note PDF 102 KB
AN-12: Using QuickSwitch to Make Dual Port RAMs Application Note PDF 58 KB
AN-15: CMOS Cus Exchange Switches for Crossbars Application Note PDF 106 KB
AN-13: Converting TTL to Hot Plug Application Note PDF 85 KB
AN-09: CMOS Bus Switches Provide 0 Delay Application Note PDF 121 KB
AN-19: Space Reduction Via Placement Application Note PDF 41 KB
AN-20: Board Assembly for 0.4mm Pin Surface Mounts Application Note PDF 62 KB
AN-17: Peripheral Isolation in Notebook Computers Application Note PDF 68 KB
PCN / PDN
PCN# : A1808-01 Transfer Assembly Location from Amkor Philippines for select pacakges Product Change Notice PDF 39 KB
PCN#: A-0410-02, Change IDT marking logo with new IDT gridless w Product Change Notice PDF 24 KB
PCN# A-0508-02: OSET Alternate Assembly Location for Green Product Change Notice PDF 18 KB
PCN#A-0504-02R1: Assembly Transfer IDT-Manila to OSE-Ph Product Change Notice PDF 16 KB
PCN#: TB-0504-01, Transfer Test & Backend from IDT-Manila to IDT Product Change Notice PDF 35 KB
PCN#: A-0504-02, Transfer assembly facility IDT-Manila to OSE-Ph Product Change Notice PDF 47 KB
PCN#: A-0501-01, New m/c DMC-2000 and d/a 8390A for PDIP pkgs Product Change Notice PDF 42 KB
PCN#:A-0401-01, new m/c G600 & 8290 d/a material Product Change Notice PDF 196 KB
PCN#:A-0312-02, new die attach material - 8290 Product Change Notice PDF 116 KB
PCN#:A-0312-01, new mold compound material - G600 Product Change Notice PDF 109 KB
PCN# G-0203-05 Mold Compound Product Change Notice PDF 40 KB
PCN# G0106-01, Moisture Sensitive Label Change Product Change Notice PDF 274 KB
PDN# Logic-00-09: Obsolete PDIP Package Product Discontinuation Notice PDF 73 KB
PCN# G0005-01, Laser Top Mark Product Change Notice PDF 24 KB
其它
PDN# L_05_01: Obsolescence Notice ALL PDF 130 KB

软件与工具

文档标题 他の言語 文档类型 文档格式 文件大小
QS3383 Hspice Model Model - HSPICE ZIP 17 KB
QS3383 IBIS Model Model - IBIS ZIP 10 KB