The QS3VH2245 is a high bandwidth 8-bit bus switch. The QS3VH2245, with 25 ohm ON resistance and 1.35ns propagation delay, is ideal for line matching and low noise environments. The combination of small propagation delay, high OFF impedance, and over-voltage tolerance makes the QS3VH2245 ideal for high performance communication applications. The QS3VH2245 operates from -40C to +85C.

Features

  • N channel FET switches with no parasitic diode to VCC
  • Isolation under power-off conditions
  • No DC path to VCC or GND
  • 5V tolerant in OFF and ON state
  • 5V tolerant I/Os
  • Flat RON characteristics over operating range
  • Rail-to-rail switching 0 - 5V
  • Bidirectional dataflow with near-zero delay: no added ground bounce
  • Excellent RON matching between channels
  • VCC operation: 2.3V to 3.6V
  • High bandwidth
  • LVTTL-compatible control Inputs
  • Undershoot Clamp Diodes on all switch and control Inputs
  • Low I/O capacitance, 4pF typical
  • 25 ohm resistors for low noise and line matching
  • Available in 20 pin QSOP and TSSOP packages

Product Options

下单器件 ID Part Status Pkg. Code Pkg. Type Lead Count (#) Temp. Grade Pb (Lead) Free Carrier Type Buy Sample
QS3VH2245PAG Active PGG20 TSSOP 20 C Yes Tube
Availability
QS3VH2245PAG8 Active PGG20 TSSOP 20 C Yes Reel
Availability
QS3VH2245QG Active PCG20 QSOP 20 C Yes Tube
Availability
QS3VH2245QG8 Active PCG20 QSOP 20 C Yes Reel
Availability

技术资料

文档标题 他の言語 文档类型 文档格式 文件大小
数据手册与勘误表
QS3VH2245 Datasheet Datasheet PDF 266 KB
Errata LEN-08-01 Errata PDF 65 KB
应用指南 &白皮书
AN-20: Board Assembly for 0.4mm Pin Surface Mounts Application Note PDF 62 KB
PCN / PDN
PCN# : A1808-01 Transfer Assembly Location from Amkor Philippines for select pacakges Product Change Notice PDF 39 KB
PCN# : A1602-01(R1) Add Greatek Taiwan as Alternate Assembly Product Change Notice PDF 611 KB
PCN# : A1602-01 Add Greatek Taiwan as Alternate Assembly Product Change Notice PDF 611 KB
PCN# : A1511-01(R1) Add SPEL India as Alternate Assembly Location Product Change Notice PDF 596 KB
PCN# : A1511-01 Add SPEL India as Alternate Assembly Location Product Change Notice PDF 544 KB
PCN# : TB1503-01R1 Carrier Tape Standardization for Selective Packages Product Change Notice PDF 333 KB
PCN# : TB1503-01 Carrier Tape Standardization for Selective Packages Product Change Notice PDF 291 KB
PCN#: A-0410-02, Change IDT marking logo with new IDT gridless w Product Change Notice PDF 24 KB
PCN# A-0508-02: OSET Alternate Assembly Location for Green Product Change Notice PDF 18 KB
PCN# A-0504-02R2: Assembly Transfer IDT-Manila to OSE-Ph Product Change Notice PDF 38 KB
PCN#A-0504-02R1: Assembly Transfer IDT-Manila to OSE-Ph Product Change Notice PDF 16 KB
PCN#: TB-0504-01, Transfer Test & Backend from IDT-Manila to IDT Product Change Notice PDF 35 KB
PCN#: A-0504-02, Transfer assembly facility IDT-Manila to OSE-Ph Product Change Notice PDF 47 KB
PCN#:A-0312-02, new die attach material - 8290 Product Change Notice PDF 116 KB
PCN#:A-0312-01, new mold compound material - G600 Product Change Notice PDF 109 KB
PCN Addendum # L0203-10R1 Fab 2 to Fab 4 Transfer Product Change Notice PDF 110 KB
PCN# L0206-11 ICCQ Max Limit Change Product Change Notice PDF 9 KB
PCN# G-0203-05 Mold Compound Product Change Notice PDF 40 KB
PCN# L0203-10 Fab Transfer from Fab 2 to Fab 4 Product Change Notice PDF 27 KB
PCN# G0202-01, Alternate assembly facility Product Change Notice PDF 16 KB
PCN# L0108-01R1, Die Revision from YQ, ZQ, QC to Z Product Change Notice PDF 12 KB
PCN# G0106-01, Moisture Sensitive Label Change Product Change Notice PDF 274 KB
PCN# G0005-01, Laser Top Mark Product Change Notice PDF 24 KB

软件与工具

文档标题 他の言語 文档类型 文档格式 文件大小
QS3VH2245 IBIS Model Model - IBIS ZIP 9 KB
QS3VH2245 Hspice Model Model - HSPICE ZIP 18 KB