The 74CBTLV3244 octal bus switch has standard 244 pinouts and is designed for asynchronous communication between data buses. Sets of four switches are controlled by one output Enable (OE). When OE is low, the set of four bus switches is on and port A is connected to port B. When OE is high, the set of four bus switches is off and a high impedance exists between port A and port B. The 74CBTLV3244 operates at -40C to +85C

Features

  • Pin-out compatible with standard '244 Logic products
  • 5 ohm A/B bi-directional switch
  • Isolation under power-off conditions
  • Over-voltage tolerant
  • Latch-up performance exceeds 100mA
  • VCC = 2.3V - 3.6V, Normal Range
  • ESD > 2000V per MIL-STD-883, Method 3015
  • > 200V using machine model (C = 200pF, R = 0)
  • Available in 20 pin QSOP and TSSOP packages

Product Options

下单器件 ID Part Status Pkg. Code Pkg. Type Lead Count (#) Temp. Grade Pb (Lead) Free Carrier Type Buy Sample
74CBTLV3244PGG Active PGG20 TSSOP 20 C Yes Tube
Availability
74CBTLV3244PGG8 Active PGG20 TSSOP 20 C Yes Reel
Availability
74CBTLV3244QG Active PCG20 QSOP 20 C Yes Tube
Availability
74CBTLV3244QG8 Active PCG20 QSOP 20 C Yes Reel
Availability

技术资料

文档标题 他の言語 文档类型 文档格式 文件大小
数据手册与勘误表
74CBTLV3244 Datasheet Datasheet PDF 91 KB
PCN / PDN
PCN# : A1808-01 Transfer Assembly Location from Amkor Philippines for select pacakges Product Change Notice PDF 39 KB
PCN# : A1602-01(R1) Add Greatek Taiwan as Alternate Assembly Product Change Notice PDF 611 KB
PCN# : A1602-01 Add Greatek Taiwan as Alternate Assembly Product Change Notice PDF 611 KB
PCN# : A1511-01(R1) Add SPEL India as Alternate Assembly Location Product Change Notice PDF 596 KB
PCN# : A1511-01 Add SPEL India as Alternate Assembly Location Product Change Notice PDF 544 KB
PCN# : TB1503-01R1 Carrier Tape Standardization for Selective Packages Product Change Notice PDF 333 KB
PCN# : TB1503-01 Carrier Tape Standardization for Selective Packages Product Change Notice PDF 291 KB
PCN# : W1503-02 Transfer of Fab 4 to TSMC Product Change Notice PDF 478 KB
PCN#: A-0410-02, Change IDT marking logo with new IDT gridless w Product Change Notice PDF 24 KB
PCN# : A0807-02 Copper Bond Wire for SSOP, SOIC and TSSOP Product Change Notice PDF 147 KB
PCN# : A-0605-05 AIT as Alternate Assembly Facility for SOIC/QSOP/SSOP/TSSOP/PDIP Product Change Notice PDF 298 KB
PCN# A-0508-02: OSET Alternate Assembly Location for Green Product Change Notice PDF 18 KB
PCN#A-0504-02R1: Assembly Transfer IDT-Manila to OSE-Ph Product Change Notice PDF 16 KB
PCN#: TB-0504-01, Transfer Test & Backend from IDT-Manila to IDT Product Change Notice PDF 35 KB
PDN# L-05-04 Selective Logic Products Obsolescence Product Discontinuation Notice PDF 173 KB
PCN#: A-0412-04 - To comply with Pb-free labels - Green Products Product Change Notice PDF 80 KB
PCN # A-0406-07Rev.1, Qualify OSE-Taiwan for SSOP & TSSOP Product Change Notice PDF 21 KB
PCN#:A-0312-02, new die attach material - 8290 Product Change Notice PDF 116 KB
PCN#:A-0312-01, new mold compound material - G600 Product Change Notice PDF 109 KB
PCN#: A-0310-01, Green Products Product Change Notice PDF 26 KB
PCN#: G-0303-04, new m/c G700 & 8290 d/a material Product Change Notice PDF 130 KB
PCN Addendum # L0203-10R1 Fab 2 to Fab 4 Transfer Product Change Notice PDF 110 KB
PCN# G-0203-05 Mold Compound Product Change Notice PDF 40 KB
PCN# L0203-10 Fab Transfer from Fab 2 to Fab 4 Product Change Notice PDF 27 KB
PCN# G0106-01, Moisture Sensitive Label Change Product Change Notice PDF 274 KB
PCN# G0005-01, Laser Top Mark Product Change Notice PDF 24 KB
PCN# G9911-05, To qualify low alpha mold compound. Product Change Notice PDF 44 KB

软件与工具

文档标题 他の言語 文档类型 文档格式 文件大小
CBTLV3244 IBIS Model Model - IBIS ZIP 8 KB
CBTLV3244 Hspice Model Model - HSPICE ZIP 16 KB