The 2305 is a low phase noise, high-speed PLL based, low-skew zero delay buffer. Based on IDT's proprietary low jitter Phase Locked Loop (PLL) techniques, the device provides four low skew outputs at speeds up to 133 MHz at 3.3 V. The outputs can be generated from the PLL (for zero delay), or directly from the input (for testing), and can be set to tri-state mode or to stop at a low level. The PLL feedback is on-chip and is obtained from the CLKOUT pad. The 2305 is available in two different versions. The 2305-1 is the base part. The 2305-1H is a high drive version with faster rise and fall times.

Features

  • Clock outputs from 10 to 133 MHz
  • Zero input-output delay
  • Four low skew (<250 ps) outputs
  • Device-to-device skew <700 ps
  • Full CMOS outputs with 25 mA output drive capability at TTL levels
  • 5 V tolerant CLKIN
  • Tri-state mode for board-level testing
  • Advanced, low power, sub-micron CMOS process
  • Operating voltage of 3.3 V
  • Industrial temperature range available
  • Packaged in 8-pin SOIC

Product Options

下单器件 ID Part Status Pkg. Code Pkg. Type Lead Count (#) Temp. Grade Pb (Lead) Free Carrier Type Buy Sample
2305-1DCG Active DCG8 SOIC 8 C Yes Tube
Availability
2305-1DCG8 Active DCG8 SOIC 8 C Yes Reel
Availability
2305-1DCGI Active DCG8 SOIC 8 I Yes Tube
Availability
2305-1DCGI8 Active DCG8 SOIC 8 I Yes Reel
Availability
2305-1HDCG Active DCG8 SOIC 8 C Yes Tube
Availability
2305-1HDCG8 Active DCG8 SOIC 8 C Yes Reel
Availability
2305-1HDCGI Active DCG8 SOIC 8 I Yes Tube
Availability
2305-1HDCGI8 Active DCG8 SOIC 8 I Yes Reel
Availability
2305M-1LF Active DCG8 SOIC 8 C Yes Tube
Availability
2305M-1LFT Active DCG8 SOIC 8 C Yes Reel
Availability
2305MI-1HLF Active DCG8 SOIC 8 I Yes Tube
Availability
2305MI-1HLFT Active DCG8 SOIC 8 I Yes Reel
Availability
2305MI-1LF Active DCG8 SOIC 8 I Yes Tube
Availability
2305MI-1LFT Active DCG8 SOIC 8 I Yes Reel
Availability

技术资料

文档标题 他の言語 文档类型 文档格式 文件大小
数据手册与勘误表
2305 Datasheet Datasheet PDF 140 KB
应用指南 &白皮书
AN-828 Termination - LVPECL Application Note PDF 229 KB
AN-845 Termination - LVCMOS Application Note PDF 62 KB
AN-844 Termination - AC Coupling Clock Receivers Application Note PDF 82 KB
AN-842 Thermal Considerations in Package Design and Selection Application Note PDF 403 KB
AN-840 Jitter Specifications for Timing Signals Application Note PDF 349 KB
AN-834 Hot-Swap Recommendations Application Note PDF 67 KB
AN-827 Application Relevance of Clock Jitter Application Note PDF 1.06 MB
AN-815 Understanding Jitter Units Application Note PDF 476 KB
AN-805 Recommended Ferrite Beads Application Note PDF 38 KB
AN-804 IDT Clock Buffers Offer Low Additive Phase Jitter Application Note PDF 162 KB
AN-229: Zero Delay Buffers Application Note PDF 67 KB
AN-82 Clock Distribution with Guaranteed Skew Application Note PDF 146 KB
PCN / PDN
PDN# : CQ-17-04 Product Discontinuance Notice Product Discontinuation Notice PDF 599 KB
PCN# : A1602-01(R1) Add Greatek Taiwan as Alternate Assembly Product Change Notice PDF 611 KB
PCN# : A1602-01 Add Greatek Taiwan as Alternate Assembly Product Change Notice PDF 611 KB
PCN# : A1511-01(R1) Add SPEL India as Alternate Assembly Location Product Change Notice PDF 596 KB
PCN# : A1511-01 Add SPEL India as Alternate Assembly Location Product Change Notice PDF 544 KB
PCN# : TB1504-01R1 Qty per Reel Standardization for Selective Packages Product Change Notice PDF 95 KB
PCN# : TB1504-01 Qty per Reel Standardization for Selective Packages Product Change Notice PDF 50 KB
PCN# : A1403-03 Gold wire to Copper wire Product Change Notice PDF 42 KB
PCN# : TB1303-02 Change of Tape & Reel Packing Method for Selective Products Product Change Notice PDF 361 KB
PCN# : A1208-01R1 Gold to Copper Wire Product Change Notice PDF 254 KB
PCN# : A1208-06 Changed of Assembly Location and Crystal Product Change Notice PDF 1.06 MB
PCN#: A-0410-02, Change IDT marking logo with new IDT gridless w Product Change Notice PDF 24 KB
PCN# : TB0904-02 QUALIFIED TEST LOCATIONS FOR MICRO CLOCK PRODUCTS Product Change Notice PDF 269 KB
PCN# : A-0605-05 AIT as Alternate Assembly Facility for SOIC/QSOP/SSOP/TSSOP/PDIP Product Change Notice PDF 298 KB
PCN#: TB-0504-01, Transfer Test & Backend from IDT-Manila to IDT Product Change Notice PDF 35 KB
PCN # L-0501-03 Die Revision Change from CD/CD4 to Z Product Change Notice PDF 156 KB
PCN#: A-0412-04 - To comply with Pb-free labels - Green Products Product Change Notice PDF 80 KB
PCN # A-0406-06 Qualify OSE Philippines for SOIC Product Change Notice PDF 100 KB
PCN#:A-0401-01, new m/c G600 & 8290 d/a material Product Change Notice PDF 196 KB
PCN#: A-0310-01, Green Products Product Change Notice PDF 26 KB
PCN Addendum # L0203-10R1 Fab 2 to Fab 4 Transfer Product Change Notice PDF 110 KB
PCN# G-0203-05 Mold Compound Product Change Notice PDF 40 KB
PCN# L0203-10 Fab Transfer from Fab 2 to Fab 4 Product Change Notice PDF 27 KB
PCN# G0106-01, Moisture Sensitive Label Change Product Change Notice PDF 274 KB
其它
Timing Solutions Products Overview Overview PDF 4.11 MB
IDT Clock Generation Overview 日本語 Overview PDF 1.83 MB
IDT Clock Distribution Overview 日本語 Overview PDF 3.79 MB

软件与工具

文档标题 他の言語 文档类型 文档格式 文件大小
2305 IBIS Model Model - IBIS ZIP 24 KB
2305 Hspice Model Model - HSPICE ZIP 88 KB