文档标题 信息
Package Description FLIP CHIP BGA 33MM X 33MM 1.0 MM PITCH
Package Status Active
Package Type FCBGA
类别 PLASTIC
Package Code RM1023
分类 RoHS
Lead Count 1023
Pb (Lead) Free No
长度 33mm
Pb Free Category e1 SnAgCu
宽度 33mm
Thickness 2mm
Peak Reflow Temp 260.00°C
Pitch 1mm
Package Carrier Tray
Pkg. Dimensions (mm) 33.0 x 33.0 x 2.0

Documentation

文档标题 他の言語 文档类型 文档格式 文件大小
其它
Recommended Reflow Profile Product/Marketing PDF 135 KB
HC/RC503 & HM/RM1023 SHIPPING TRAY Carrier / Package Type PDF 98 KB
HM/RM 1023 PACKAGE OUTLINE 33 x 33 mm BODY 1.00 mm PITCH FCBGA Package Outline Drawing PDF 220 KB
RM1023 IPC-1752-2 v1.1 Class 6 (MCD) Materials Composition Declaration PDF 293 KB
RM1023 IPC 1752-1 v1.1 Class 4 (MCD) Materials Composition Declaration PDF 250 KB