文档标题 信息
Package Description FLIP CHIP BGA 27 X 27 MM 1.0 MM PITCH
Package Status Active
Package Type FCBGA
类别 PLASTIC
Package Code HMH675
分类 RoHS
Lead Count 675
Pb (Lead) Free No
长度 27mm
Pb Free Category e0
宽度 27mm
Thickness 2.41mm
Peak Reflow Temp 225.00°C
Pitch 1mm
Package Carrier Tray
Pkg. Dimensions 27.0 x 27.0 x 2.41

Documentation

文档标题 他の言語 文档类型 文档格式 文件大小
其它
Recommended Reflow Profile Product/Marketing PDF 135 KB
BB/BBG416, BG/BGG256/272, BH/BHG580/675, BL/BLG676, BR672/676, BX/BXG420, HL/HLG/HMG/RM676 & HM/HMG/HMH/RM675 SHIPPING TRAY Carrier / Package Type PDF 95 KB