文档标题 信息
Package Description FLIP CHIP BGA 19.0 X 19.0 MM X 1.0 MM
Package Status Active
Package Type FCBGA
类别 PLASTIC
Package Code HLG324
分类 G
Lead Count 324
Pb (Lead) Free Yes
长度 19mm
Pb Free Category e1 SnAgCu
宽度 19mm
Thickness 3.02mm
Peak Reflow Temp 260.00°C
Pitch 1mm
Package Carrier Reel, Tray
Pkg. Dimensions (mm) 19.0 x 19.0 x 3.02

Documentation

文档标题 他の言語 文档类型 文档格式 文件大小
其它
Recommended Reflow Profile Product/Marketing PDF 135 KB
Quadrant 1 Loading Orientation in Reel form Carrier / Package Type PDF 114 KB
13" PLASTIC REEL WITH 4" HUB Carrier / Package Type PDF 53 KB
COVER TAPE Carrier / Package Type PDF 28 KB
AL/ALG/AR/HL/HLG324 & ALG484 CARRIER TAPE Carrier / Package Type PDF 27 KB
AL/ALG/AR324, ALG484, BB/BBG240/324, BC/BCG324, BF/BFG484, HL/HLG324 & HM/HMG/RM324 SHIPPING TRAY Carrier / Package Type PDF 120 KB
HLG324 IPC-1752-2 v1.01 Class 6 (MCD) Materials Composition Declaration PDF 306 KB
HL/HLG 324 PACKAGE OUTLINE 19.0 x 19.0 mm BODY 1.00 mm BALLPITCH FCBGA Package Outline Drawing PDF 207 KB
Green Products RoHS Material Declaration Certificate Certificates / Reports PDF 95 KB
HLG324 IPC 1752-1 v1.1 Class 4 (MCD) Materials Composition Declaration PDF 250 KB