文档标题 信息
Package Description SHRINK SOT SC-70
Package Status Active
Package Type SOIC
类别 PLASTIC
Package Code DY5
分类 240
Lead Count 5
Pb (Lead) Free No
长度 3mm
Pb Free Category e0
宽度 1.75mm
Thickness 1.3mm
Peak Reflow Temp 240.00°C
Pitch 0.95mm
Package Carrier Can
Pkg. Dimensions (mm) 3.0 x 1.75 x 1.3

Documentation

文档标题 他の言語 文档类型 文档格式 文件大小
其它
Recommended Reflow Profile Product/Marketing PDF 135 KB
SOIC MARKETING DRAWING (.050" PITCH) (EIAJ) Package Outline Drawing PDF 134 KB
DY5 IPC 1752-1 v1.01 Class 4 (MCD) Materials Composition Declaration PDF 519 KB
DY5 IPC-1752-2 v1.01 Class 6 (MCD) Materials Composition Declaration PDF 793 KB
DY PACKAGE OUTLINE 1.25 MM BODY WIDTH SHRINK SOT .65 MM LEAD PITCH Carrier / Package Type PDF 74 KB