文档标题 信息
Package Description CHIP ARRAY BGA 13.0 X 15.0 MM X 1.0 MM P
Package Status Active
Package Type CABGA
类别 PLASTIC
Package Code BQG165
分类 G
Lead Count 165
Pb (Lead) Free Yes
长度 15mm
Pb Free Category e1 SnAgCu
宽度 13mm
Thickness 1.2mm
Peak Reflow Temp 260.00°C
Pitch 1mm
Package Carrier Reel, Tray
Pkg. Dimensions (mm) 15.0 x 13.0 x 1.2

Documentation

文档标题 他の言語 文档类型 文档格式 文件大小
PCN / PDN
PCN# : A0705-02 New Mold Compound for CABGA-256, FPBGA-48, FPBGA-165 Product Change Notification PDF 138 KB
其它
Recommended Reflow Profile Product/Marketing PDF 135 KB
Quadrant 1 Loading Orientation in Reel form Carrier / Package Type PDF 114 KB
BQ/BQG165 SHIPPING TRAY Carrier / Package Type PDF 143 KB
13" PLASTIC REEL WITH 4" HUB Carrier / Package Type PDF 53 KB
COVER TAPE Carrier / Package Type PDF 28 KB
BQ/BQG 165 CARRIER TAPE Carrier / Package Type PDF 23 KB
BQ PACKAGE OUTLINE 13.0 X 15.0 MM BODY FPBGA Package Outline Drawing PDF 170 KB
Green Products RoHS Material Declaration Certificate Certificates / Reports PDF 95 KB
BQG165 IPC-1752-2 v1.1 Class 6 (MCD) Materials Composition Declaration PDF 289 KB
BQG165 IPC 1752-1 v1.01 Class 4 (MCD) Materials Composition Declaration PDF 528 KB