文档标题 信息
Package Description FLIP CHIP BGA 35 X 35 MM X 1.0MM PITCH
Package Status Active
Package Type FCBGA
类别 PLASTIC
Package Code BLH1156
分类 240
Lead Count 1156
Pb (Lead) Free No
长度 35mm
Pb Free Category e0
宽度 35mm
Thickness 2.82mm
Peak Reflow Temp 245.00°C
Pitch 1mm
Package Carrier Tray
Pkg. Dimensions (mm) 35.0 x 35.0 x 2.82

Documentation

文档标题 他の言語 文档类型 文档格式 文件大小
其它
Recommended Reflow Profile Product/Marketing PDF 135 KB
BL/BLG/BLH/BR1156 SHIPPING TRAY Carrier / Package Type PDF 101 KB
BL/BR PACKAGE OUTLINE 35.0 X 35.0mm BODY 1.0 mm BALLPITCH FCBGA Package Outline Drawing PDF 312 KB