文档标题 信息
Package Description CHIP ARRAY BGA 15.0 X 15.0 MM X 0.8 MM P
Package Status Active
Package Type CABGA
类别 PLASTIC
Package Code BFG208
分类 G
Lead Count 208
Pb (Lead) Free Yes
长度 15mm
Pb Free Category e1 SnAgCu
宽度 15mm
Thickness 1.4mm
Peak Reflow Temp 260.00°C
Pitch 0.8mm
Package Carrier Reel, Tray
Pkg. Dimensions (mm) 15.0 x 15.0 x 1.4

Documentation

文档标题 他の言語 文档类型 文档格式 文件大小
PCN / PDN
PCN# : A0704-02 New Die Attach Material for CABGA-256, FPBGA-96/208, CVBGA-52/56, PBGA-119/272/416 Product Change Notification PDF 177 KB
PCN# : A-0610-02 ASAT China as Alternate Facility for CABGA/CVBGA/FPBGA/TQFP/PQFP Product Change Notification PDF 252 KB
PCN# A-0607-05 Green Mold Compound KMC3580 for BGA Product Change Notification PDF 194 KB
PCN# A-0601-01 AIT as Alternate Assembly Location Product Change Notification PDF 281 KB
其它
Recommended Reflow Profile Product/Marketing PDF 135 KB
Quadrant 1 Loading Orientation in Reel form Carrier / Package Type PDF 114 KB
13" PLASTIC REEL WITH 4" HUB Carrier / Package Type PDF 53 KB
COVER TAPE Carrier / Package Type PDF 28 KB
BC/BCG 196 & BF/BFG 208/289 SHIPPING TRAY Carrier / Package Type PDF 105 KB
BB/BBG 160, BF/BFG 208/289 & BG/BGG 121 CARRIER TAPE Drawings PDF 28 KB
BF/BFG PACKAGE OUTLINE 15.0 X 15.0 MM BODY FPBGA Package Outline Drawing PDF 196 KB
Green Products RoHS Material Declaration Certificate Certificates / Reports PDF 95 KB
BFG208 IPC 1752-1 v1.1 Class 4 (MCD) Materials Composition Declaration PDF 250 KB
BFG208 IPC-1752-2 v1.1 Class 6 (MCD) Materials Composition Declaration PDF 258 KB