70T25S17BFI Quick Packaging Info

Obsolete

文档标题 信息
Product Number: 70T25S17BFI
Pkg. Description: CHIP ARRAY BGA 10.0 X 10.0 MM X 0.8 MM P
Pkg. Code: BF100
Lead Count: 100
Length: 10
Width: 10
Thickness: 1.4
Moisture Sensitivity Bake: 24
Moisture Exposure Floor Life: 168hrs@<30C/60%RH
Category: 240
Pb (Lead) Free:
JEDEC Standard: MO-205
文档标题 信息
Carrier Type: Tray
Qty. per Carrier: 240
Pkg. Type: CABGA
Qty. per Reel: 0
Tape Pin 1 Quad: 0
Moisture Sensitivity Level (MSL): 3
Pkg. Class: PLASTIC
Re-bake Conditions: 48hrs@125C
Peak Reflow Temp: 225
Pb Free Category: e0