89H24NT24G2ZCHLG Quick Packaging Info

有效

文档标题 信息
Product Number: 89H24NT24G2ZCHLG
Pkg. Description: FLIP CHIP BGA 19.0 X 19.0 MM X 1.0 MM
Pkg. Code: HLG324
Lead Count: 324
Length: 19
Width: 19
Thickness: 3.0
Moisture Sensitivity Bake: 24
Moisture Exposure Floor Life: 72hrs@<30C/60%RH
Category: G
Pb (Lead) Free: 是的
文档标题 信息
Carrier Type: Tray
Qty. per Carrier: 84
Pkg. Type: FCBGA
Qty. per Reel: 0
Moisture Sensitivity Level (MSL): 4
Pkg. Class: PLASTIC
Re-bake Conditions: 48hrs@125C
Peak Reflow Temp: 260
Pb Free Category: e1 SnAgCu