70V3599S133BFGI8 Quick Packaging Info

有效

文档标题 信息
Product Number: 70V3599S133BFGI8
Pkg. Description: CHIP ARRAY BGA 15.0 X 15.0 MM X 0.8 MM P
Pkg. Code: BFG208
Lead Count: 208
Length: 15
Width: 15
Thickness: 1.4
Moisture Sensitivity Bake: 24
Moisture Exposure Floor Life: 168hrs@<30C/60%RH
Category: G
Pb (Lead) Free: 是的
JEDEC Standard: ?
文档标题 信息
Carrier Type: Reel
Qty. per Carrier: 0
Pkg. Type: CABGA
Qty. per Reel: 1000
Reel Size: 13
Tape Pin 1 Quad: 1
Tape Pocket Pitch: 20
Moisture Sensitivity Level (MSL): 3
Pkg. Class: PLASTIC
Re-bake Conditions: 48hrs@125C
Peak Reflow Temp: 260
Pb Free Category: e1 SnAgCu