70T3319S133BFGI Quick Packaging Info

有效

文档标题 信息
Product Number: 70T3319S133BFGI
Pkg. Description: CHIP ARRAY BGA 15.0 X 15.0 MM X 0.8 MM P
Pkg. Code: BFG208
Lead Count: 208
Length: 15
Width: 15
Thickness: 1.4
Moisture Sensitivity Bake: 24
Moisture Exposure Floor Life: 168hrs@<30C/60%RH
Category: G
Pb (Lead) Free: 是的
JEDEC Standard: ?
文档标题 信息
Carrier Type: Tray
Qty. per Carrier: 126
Pkg. Type: CABGA
Qty. per Reel: 0
Moisture Sensitivity Level (MSL): 3
Pkg. Class: PLASTIC
Re-bake Conditions: 48hrs@125C
Peak Reflow Temp: 260
Pb Free Category: e1 SnAgCu