70T3319S166BF8 Quick Packaging Info

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文档标题 信息
Product Number: 70T3319S166BF8
Pkg. Description: CHIP ARRAY BGA 15.0 X 15.0 MM X 0.8 MM P
Pkg. Code: BF208
Lead Count: 208
Length: 15
Width: 15
Thickness: 1.4
Moisture Sensitivity Bake: 24
Moisture Exposure Floor Life: 72hrs@<30C/60%RH
Category: 240
Pb (Lead) Free:
JEDEC Standard: MO-205
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Carrier Type: Reel
Qty. per Carrier: 0
Pkg. Type: CABGA
Qty. per Reel: 1000
Reel Size: 13
Tape Pin 1 Quad: 1
Tape Pocket Pitch: 20
Moisture Sensitivity Level (MSL): 4
Pkg. Class: PLASTIC
Re-bake Conditions: 48hrs@125C
Peak Reflow Temp: 225
Pb Free Category: e0