TSI110-167CL Quick Packaging Info

Obsolete

文档标题 信息
Product Number: TSI110-167CL
Pkg. Description: FLIP CHIP BGA X 35 MM X 1.0MM PITCH
Pkg. Code: HM1023
Lead Count: 1023
Length: 33
Width: 33
Thickness: 2.0
Moisture Sensitivity Bake: 24
Moisture Exposure Floor Life: 72hrs@<30C/60%RH
Category: 240
Pb (Lead) Free:
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Carrier Type: Tray
Qty. per Carrier: 24
Pkg. Type: FCBGA
Qty. per Reel: 0
Moisture Sensitivity Level (MSL): 4
Pkg. Class: PLASTIC
Re-bake Conditions: 48hrs@125C
Peak Reflow Temp: 225
Pb Free Category: e0